Challenges in packaging of IR detectors - technology of elastic electrical connections
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چکیده
منابع مشابه
Reliability challenges in 3D IC packaging technology
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2016
ISSN: 1757-8981,1757-899X
DOI: 10.1088/1757-899x/104/1/012007